Reproducing audio signals with a haptic apparatus on acoustic headphones and their calibration and measurement

ABSTRACT

Method and devices for testing a headphone with increased sensation are provided. The headphone can filter and amplify low frequency audio signals, which are then sent to a haptic device in the headphone. The haptic device can cause bass sensations at the top of the skull and at both ear cups. The testing system can evaluate the haptic and acoustic sensations produced by the headphone to evaluate if they have been properly assembled and calibrate the headphones if necessary.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/512,679, filed on Oct. 13, 2014, entitled “Reproducing Audio Signalswith a Haptic Apparatus on Acoustic Headphones and their Calibration andMeasurement,” which is a continuation-in-part of U.S. application Ser.No. 14/269,015, filed on May 2, 2014, now U.S. Pat. No. 8,892,233,entitled “Methods and Devices for Creating and Modifying Sound Profilesfor Audio Reproduction Devices,” which is a continuation of U.S.application Ser. No. 14/181,512, filed on Feb. 14, 2014, now U.S. Pat.No. 8,767,996, entitled “Methods and Devices for Reproducing AudioSignals with a Haptic Apparatus on Acoustic Headphones,” which claimspriority to U.S. Provisional Application No. 61/924,148, filed on Jan.6, 2014, entitled “Methods and Devices for Reproducing Audio Signalswith a Haptic Apparatus on Acoustic Headphones,” all four of which areincorporated by reference herein in their entirety.

TECHNICAL FIELD

The present invention is directed to improving the auditory experienceof headphone users with a haptic device and with sound profiles based onuser settings, or matched to a specific song, artist, or genre.

BACKGROUND

Due to their increased wavelengths, low frequencies usually requirelarge drivers (e.g., subwoofers) to generate higher volume. In vehicleand home stereo applications, large amplifiers are used to drive largedrivers (subwoofers), which have become very popular in car audio.

Many users of mobile devices, such as iPods, tablets, and smartphones,seek an immersive audio experience. Earbuds (i.e., headphones that fitdirectly in the outer ear) can be power efficient, but often lackdrivers sufficiently powerful to create bass. On-ear (i.e., supra-aural)or over-the-ear headphones (i.e., circumaural) can incorporate largerdrivers, but can be power hungry. On-ear and over-the-ear headphones canalso seal the volume of air between the ear and the headphone toincrease the reproduction of bass. Users of these designs perceive abass experience when higher Sound Pressure Levels (“SPL”) are generatedwithin the headphones by modulating the air volume between the ear andthe headphones to recreate low frequency content. This reproduces anaudio experience similar to what was initially recorded, but does notreproduce the same effect since the amount of air modulated is limitedto that which is within the ear canal.

Increased SPL may contribute to the masking of certain sounds, thusaffecting the overall auditory experience. Increased SPL can also causetemporary or permanent impairment over time.

SUMMARY

The present inventors recognized the need to create an increased bassresponse in a mobile headphone with minimal power demands and withoutincreasing SPL. Further, the present inventors recognized the need tomodify the sound profile of headphones to match a user, genre, artist,or song.

Various implementations of the subject matter described herein mayprovide one or more of the following advantages. In one or moreimplementations, the techniques and apparatus described herein canenhance the bass sensation. The bass sensation can be enhanced withoutnecessarily increasing the SPL. Additionally, in one or moreimplementations, the techniques and apparatus described herein canoperate using less power than conventional means.

In various implementations the auditory experience can be enhanced bymatching the sound profile of the headphones to a particular user,genre, artist, or song.

These general and specific techniques can be implemented using anapparatus, a method, a system, or any combination of apparatuses,methods, and systems. The details of one or more implementations are setforth in the accompanying drawings and the description below. Furtherfeatures, aspects, and advantages will become apparent from thedescription, the drawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows headphones in a user environment.

FIGS. 2A-2B show headphones including a haptic device.

FIG. 3 shows a block diagram of headphones.

FIG. 4 shows a block diagram of a mobile device.

FIG. 5 shows steps for processing information for reproduction inheadphones.

FIG. 6 shows steps for obtaining and applying sound profiles.

FIG. 7 shows another set of headphones including multiple hapticdevices.

FIG. 8 shows a haptic-headphone-testing environment.

FIGS. 9A-9B show a haptic-headphone-testing test structure.

FIGS. 10A-10G show images of a graphical user interfaces for testinghaptic headphones.

FIG. 11 shows a block diagram of a haptic-headphone testing device.

FIG. 12 shows steps for testing haptic headphones.

Like reference symbols indicate like elements throughout thespecification and drawings.

DETAILED DESCRIPTION

FIG. 1 shows headphones in a user environment 100. User 105 is listeningto headphones 120. Headphones 120 can be of the on-the-ear orover-the-ear type. Headphones 120 can be connected to mobile device 110.Mobile device 110 can be a smartphone, portable music player, portablevideo game or any other type of mobile device capable of generatingaudio entertainment. In some implementations, mobile device 110 can beconnected to headphone 120 using audio cable 130, which allows mobiledevice 110 to transmit an audio signal to headphones 120. Such cable 130can be a traditional audio cable that connects to mobile device 110using a standard headphone jack. The audio signal transmitted over cable130 can be of sufficient power to drive, i.e., create sound, atheadphones 120. In other implementations, mobile device 110 canalternatively connect to headphones 120 using wireless connection 160.Wireless connection 160 can be a Bluetooth, Low Power Bluetooth, orother networking connection. Wireless connection 160 can transmit audioinformation in a compressed or uncompressed format. The headphones wouldthen provide their own power source to amplify the audio data and drivethe headphones.

Headphones 120 can include stereo speakers including separate driversfor the left and right ear to provide distinct audio to each ear.Headphones 120 can include a haptic device 170 to create a basssensation by providing vibrations through the top of the headphone band.Headphone 120 can also provide vibrations through the left and right earcups using the same or other haptic devices. Headphone 120 can includeadditional circuitry to process audio and drive the haptic device.

Mobile device 110 can play compressed audio files, such as those encodedin MP3 or AAC format. Mobile device 110 can decode, obtain, and/orrecognize metadata for the audio it is playing back, such as through ID3tags or other metadata. The audio metadata can include the name of theartists performing the music, the genre, and/or the song title. Mobiledevice 110 can use the metadata to match a particular song, artist, orgenre to a predefined sound profile. Such a sound profile can includewhich frequencies or audio components to enhance or suppress, allowingthe alteration of the playback in a way that enhances the auditoryexperience. The sound profiles can be different for the left and rightchannel. For example, if a user requires a louder sound in one ear, thesound profile can amplify that channel more. In another example, theimmersion experience can be tailored to specific music genres blendingthe haptic sensation along with audio from the ear cup drivers.Specifically, bass heavy genres (i.e. hip-hop, dance music, and rap) canhave enhanced haptic output. Although the immersive initial settings area unique blending of haptic, audio, and headphone clamping forces, theend user can tune haptic, as well as equalization to suit his or hertastes. Genre-based sound profiles can include rock, pop, classical,hip-hop/rap, and dance music. In another implementation, the soundprofile could modify the settings for Alpine's MX algorithm, aproprietary sound enhancement algorithm, or other sound enhancementalgorithms known in the art.

Mobile device 110 can connect to Internet 140 over networking connection150 to obtain the sound profile. Network connection 150 can be wired orwireless. Mobile device 110 can obtain the sound profiles in real time,such as when mobile device 110 is streaming music, or can download soundprofiles in advance for any music or audio stored on mobile device 110.Mobile device 110 can allow users to tune the sound profile of theirheadphone to their own preferences. For example, mobile device 110 canuse Alpine's Tune-It mobile application. Tune-It can allow users quicklymodify their headphone devices to suite their individual tastes.Additionally, Tune-It can communicate settings and parameters (metadata) to a server on the Internet, and allow the server to associatesound settings with music genres. These associations and settings canaid in sound tuning for other productions and other modalities, like theautomotive environment. For example, in the automotive environment,sound tuning parameters can be output to the vehicle sound system tomeet customer sound tastes.

Audio cable 130 or wireless connection 160 can also transmit non-audioinformation to headphone 120. The non-audio information can includesound profiles. In other implementations, the non-audio information caninclude haptic information to create a haptic event using the hapticdevice. For example, the non-audio information could instruct theheadphones to create one or more shaking sensations of particularfrequencies and durations when an explosion happens in a game on mobiledevice 110.

FIGS. 2A-2B show headphones including a haptic device. In both figures,headphone 200 includes headband 210. Right ear cup 220 is attached toone end of headband 210. Right ear cup 220 can include a driver thatpushes a speaker to reproduce audio. Left ear cup 230 is attached to theopposite end of headband 210 and can similarly include a driver thatpushes a speaker to reproduce audio. The top of headband 210 can includehaptic device 240. Haptic device 240 can be covered by cover 250.Padding 245 can cover the cover 250. Right ear cup 220 can include apower source 270 and recharging jack 295. Left ear cup 230 can includesignal processing components 260 inside of it, and headphone jack 280.Left ear cup 230 can have control 290 attached. Headphone jack 280 canaccept an audio cable to receive audio signals from a mobile device.Control 290 can be used to adjust audio settings, such as to increasethe bass response or the haptic response. In other implementations, thelocation of power source 270, recharging jack 295, headphone jack 280,and signal processing components 260 can swap ear cups, or be combinedinto either single ear cup.

Multiple components are involved in both the haptic and sound profilefunctions of the headphones. These functions are discussed on acomponent-by-component basis below.

Power source 270 can be a battery or other power storage device known inthe art. In one implementation it can be one or more batteries that areremovable and replaceable. For example, it could be an AAA alkalinebattery. In another implementation it could be a rechargeable batterythat is not removable. Right ear cup 220 can include recharging jack 295to recharge the battery. Recharging jack 295 can be in the micro USBformat. Power source 270 can provide power to signal processingcomponents 260. Power source 270 can provide power to signal processingcomponents 260. Power source 270 can last at least 10 hours.

Signal processing components 260 can receive stereo signals fromheadphone jack 280 or through a wireless networking device, processsound profiles received from headphone jack 280 or through wirelessnetworking, create a mono signal for haptic device 240, and amplify themono signal to drive haptic device 240. In another implementation,signal processing components 260 can also amplify the right audiochannel that drives the driver in the right ear cup and amplify the leftaudio channel that drives the left audio cup. Signal processingcomponents 260 can deliver a low pass filtered signal to the hapticdevice that is mono in nature but derived from both channels of thestereo audio signal. Because it can be difficult for users todistinguish the direction or the source of bass in a home or automotiveenvironment, combining the low frequency signals into a mono signal forbass reproduction can simulate a home or car audio environment. Inanother implementation, signal processing components 260 can deliverstereo low-pass filtered signals to haptic device 240.

In one implementation, signal processing components 260 can include ananalog low-pass filter. The analog low-pass filter can use inductors,resistors, and/or capacitors to attenuate high-frequency signals fromthe audio. Signal processing components 260 can use analog components tocombine the signals from the left and right channels to create a monosignal, and to amplify the low-pass signal sent to haptic device 240.

In another implementation, signal processing components 260 can bedigital. The digital components can receive the audio information, via anetwork. Alternatively, they can receive the audio information from ananalog source, convert the audio to digital, low-pass filter the audiousing a digital signal processor, and provide the low-pass filteredaudio to a digital amplifier.

Control 290 can be used to modify the audio experience. In oneimplementation, control 290 can be used to adjust the volume. In anotherimplementation, control 290 can be used to adjust the bass response orto separately adjust the haptic response. Control 290 can provide aninput to signal processing components 260.

Haptic device 240 can be made from a small transducer (e.g. a motorelement) which transmits low frequencies (e.g. 1 Hz-100 Hz) to theheadband. The small transducer can be less than 1.5″ in size and canconsume less than 1 watt of power. Haptic device 240 can be an off-theshelf haptic device commonly used in touch screens or for exciters toturn glass or plastic into a speaker. Haptic device 240 can use a voicecoil or magnet to create the vibrations.

Haptic device 240 can be positioned so it is displacing directly on theheadband 210. This position allows much smaller and thus power efficienttransducers to be utilized. The housing assembly for haptic device 240,including cover 250, is free-floating, which can maximize articulationof haptic device 240 and reduces dampening of its signal.

The weight of haptic device 240 can be selected as a ratio to the massof the headband 210. The mass of haptic device 240 can be selecteddirectly proportional to the rigid structure to enable sufficientacoustic and mechanical energy to be transmitted to the ear cups. If themass of haptic device 240 were selected to be significantly lower thanthe mass of the headband 210, then headband 210 would dampen allmechanical and acoustic energy. Conversely, if the mass of haptic device240 were significantly higher than the mass of the rigid structure, thenthe weight of the headphone would be unpleasant for extended usage andmay lead to user fatigue. Haptic device 240 is optimally placed in thetop of headband 210. This positioning allows the gravity of the headbandto generate a downward force that increases the transmission ofmechanical vibrations from the haptic device to the user. The top of thehead also contains a thinner layer of skin and thus locating hapticdevice 240 here provides more proximate contact to the skull. The uniqueposition of haptic device 240 can enable the user to experience animmersive experience that is not typically delivered via traditionalheadphones with drivers located merely in the headphone cups.

The haptic device can limit its reproduction to low frequency audiocontent. For example, the audio content can be limited to less than 100Hz. Vibrations from haptic device 240 can be transmitted from hapticdevice 240 to the user through three contact points: the top of theskull, the left ear cup, and the right ear cup. This creates animmersive bass experience. Because headphones have limited power storagecapacities and thus require higher energy efficiencies to satisfydesired battery life, the use of a single transducer in a location thatmaximizes transmission across the three contact points also creates apower-efficient bass reproduction.

Cover 250 can allow haptic device 240 to vibrate freely. Headphone 200can function without cover 250, but the absence of cover 250 can reducethe intensity of vibrations from haptic device 240 when a user's skullpresses too tightly against haptic device 240.

Padding 245 covers haptic device 240 and cover 250. Depending on itssize, shape, and composition, padding 245 can further facilitate thetransmission of the audio and mechanical energy from haptic device 240to the skull of a user. For example, padding 245 can distribute thetransmission of audio and mechanical energy across the skull based onits size and shape to increase the immersive audio experience. Padding245 can also dampen the vibrations from haptic device 240.

Headband 210 can be a rigid structure, allowing the low frequency energyfrom haptic device 240 to transfer down the band, through the left earcup 230 and right ear cup 220 to the user. Forming headband 210 of arigid material facilitates efficient transmission of low frequency audioto ear cups 230 and 220. For example, headband 210 can be made from hardplastic like polycarbonate or a lightweight metal like aluminum. Inanother implementation, headband 210 can be made from spring steel.Headband 210 can be made such that the material is optimized formechanical and acoustic transmissibility through the material. Headband210 can be made by selecting specific type materials as well as a formfactor that maximizes transmission. For example, by utilizing reinforcedribbing in headband 210, the amount of energy dampened by the rigid bandcan be reduced and enable more efficient transmission of the mechanicaland acoustic frequencies to be passed to the ear cups 220 and 230.

Headband 210 can be made with a clamping force measured between ear cups220 and 230 such that the clamping force is not so tight as to reducevibrations and not so loose as to minimize transmission of thevibrations. The clamping force can be in the range of 300 g to 600 g.

Ear cups 220 and 230 can be designed to fit over the ears and to coverthe whole ear. Ear cups 220 and 230 can be designed to couple andtransmit the low frequency audio and mechanical energy to the user'shead. Ear cups 220 and 230 may be static. In another implementation, earcups 220 and 230 can swivel, with the cups continuing to be attached toheadband 210 such that they transmit audio and mechanical energy fromheadband 210 to the user regardless of their positioning.

Vibration and audio can be transmitted to the user via multiple methodsincluding auditory via the ear canal, and bone conduction via the skullof the user. Transmission via bone conduction can occur at the top ofthe skull and around the ears through ear cups 220 and 230. This featurecreates both an aural and tactile experience for the user that issimilar to the audio a user experiences when listening to audio from asystem that uses a subwoofer. For example, this arrangement can create aheadphone environment where the user truly feels the bass.

FIG. 3 shows a block diagram of a headphone. FIG. 3 presents headphonesystem 300 that can be used to implement the techniques described hereinfor an enhanced audio experience. Headphone system 300 can beimplemented inside of headphones 200. Headphone system 300 can be partof signal processing components 260. Headphones 200 can include bus 365that connects the various components. Bus 365 can be composed ofmultiple channels or wires, and can include one or more physicalconnections to permit unidirectional or omnidirectional communicationbetween two or more of the components in headphone system 300.Alternatively, components connected to bus 365 can be connected toheadphone system 300 through wireless technologies such as Bluetooth,Wifi, or cellular technology.

An input 340 including one or more input devices can be configured toreceive instructions and information. For example, in someimplementations input 340 can include a number of buttons. In some otherimplementations input 340 can include one or more of a touch pad, atouch screen, a cable interface, and any other such input devices knownin the art. Input 340 can include knob 290. Further, audio and imagesignals also can be received by the headphone system 300 through theinput 340.

Headphone jack 310 can be configured to receive audio and/or datainformation. Audio information can include stereo or other multichannelinformation. Data information can include metadata or sound profiles.Data information can be sent between segments of audio information, forexample between songs, or modulated to inaudible frequencies andtransmitted with the audio information.

Further, headphone system 300 can include network interface 380. Networkinterface 380 can be wired or wireless. A wireless network interface 380can include one or more radios for making one or more simultaneouscommunication connections (e.g., wireless, Bluetooth, low powerBluetooth, cellular systems, PCS systems, or satellite communications).Network interface 380 can receive audio information, including stereo ormultichannel audio, or data information, including metadata or soundprofiles.

An audio signal, user input, metadata, other input or any portion orcombination thereof, can be processed in headphone system 300 using theprocessor 350. Processor 350 can be used to perform analysis,processing, editing, playback functions, or to combine various signals,including adding metadata to either or both of audio and image signals.Processor 350 can use memory 360 to aid in the processing of varioussignals, e.g., by storing intermediate results. Processor 350 caninclude A/D processors to convert analog audio information to digitalinformation. Processor 350 can also include interfaces to pass digitalaudio information to amplifier 320. Processor 350 can process the audioinformation to apply sound profiles, create a mono signal and apply lowpass filter. Processor 350 can also apply Alpine's MX algorithm.

Processor 350 can low pass filter audio information using an active lowpass filter to allow for higher performance and the least amount ofsignal attenuation. The low pass filter can have a cut off ofapproximately 80 Hz-100 Hz. The cut off frequency can be adjusted basedon settings received from input 340 or network 380. Processor 350 canparse metadata and request sound profiles via network 380.

In another implementation, passive filter 325 can combine the stereoaudio signals into a mono signal, apply the low pass filter, and sendthe mono low pass filter signal to amplifier 320.

Memory 360 can be volatile or non-volatile memory. Either or both oforiginal and processed signals can be stored in memory 360 forprocessing or stored in storage 370 for persistent storage. Further,storage 370 can be integrated or removable storage such as SecureDigital, Secure Digital High Capacity, Memory Stick, USB memory, compactflash, xD Picture Card, or a hard drive.

The audio signals accessible in headphone system 300 can be sent toamplifier 320. Amplifier 320 can separately amplify each stereo channeland the low-pass mono channel. Amplifier 320 can transmit the amplifiedsignals to speakers 390 and haptic device 240. In anotherimplementation, amplifier 320 can solely power haptic device 240.Amplifier 320 can consume less than 2.5 Watts.

FIG. 4 shows a block diagram of mobile device 110. FIG. 4 presents acomputer system 400 that can be used to implement the techniquesdescribed herein for sharing digital media. Computer system 400 can beimplemented inside of mobile device 110. Bus 465 can include one or morephysical connections and can permit unidirectional or omnidirectionalcommunication between two or more of the components in the computersystem 400. Alternatively, components connected to bus 465 can beconnected to computer system 400 through wireless technologies such asBluetooth, Wifi, or cellular technology. The computer system 400 caninclude a microphone 445 for receiving sound and converting it to adigital audio signal. The microphone 445 can be coupled to bus 465,which can transfer the audio signal to one or more other components.Computer system 400 can include a headphone jack 460 for transmittingaudio and data information to headphones and other audio devices.

An input 440 including one or more input devices also can be configuredto receive instructions and information. For example, in someimplementations input 440 can include a number of buttons. In some otherimplementations input 440 can include one or more of a mouse, akeyboard, a touch pad, a touch screen, a joystick, a cable interface,and any other such input devices known in the art. Further, audio andimage signals also can be received by the computer system 400 throughthe input 440.

Further, computer system 400 can include network interface 420. Networkinterface 420 can be wired or wireless. A wireless network interface 420can include one or more radios for making one or more simultaneouscommunication connections (e.g., wireless, Bluetooth, low powerBluetooth, cellular systems, PCS systems, or satellite communications).A wired network interface 420 can be implemented using an Ethernetadapter or other wired infrastructure.

An audio signal, image signal, user input, metadata, other input or anyportion or combination thereof, can be processed in the computer system400 using the processor 410. Processor 410 can be used to performanalysis, processing, editing, playback functions, or to combine varioussignals, including parsing metadata to either or both of audio and imagesignals.

For example, processor 410 can parse metadata from a song or videostored on computer system 400 or being streamed across network interface420. Processor 410 can use the metadata to request sound profiles fromthe Internet through network interface 420 or from storage 430 for thespecific song or video based on the artist, genre, or specific song orvideo. Processor 410 can then use input received from input 440 tomodify a sound profile according to a user's preferences. Processor 410can then transmit the sound profile to a headphone connected throughnetwork interface 420 or headphone jack 460 and/or store a new soundprofile in storage 430. Processor 410 can run applications on computersystem 400 like Alpine's Tune-It mobile application, which can adjustsound profiles. The sound profiles can be used to adjust Alpine's MXalgorithm.

Processor 410 can use memory 415 to aid in the processing of varioussignals, e.g., by storing intermediate results. Memory 415 can bevolatile or non-volatile memory. Either or both of original andprocessed signals can be stored in memory 415 for processing or storedin storage 430 for persistent storage. Further, storage 430 can beintegrated or removable storage such as Secure Digital, Secure DigitalHigh Capacity, Memory Stick, USB memory, compact flash, xD Picture Card,or a hard drive.

Image signals accessible in computer system 400 can be presented on adisplay device 435, which can be an LCD display, printer, projector,plasma display, or other display device. Display 435 also can displayone or more user interfaces such as an input interface. The audiosignals available in computer system 400 also can be presented throughoutput 450. Output device 450 can be a speaker. Headphone jack 460 canalso be used to communicate digital or analog information, includingaudio and sound profiles.

FIG. 5 shows steps for processing information for reproduction inheadphones. Headphones can monitor a connection to determine when audiois received, either through an analog connection or digitally (505).When audio is received, any analog audio can be converted from analog todigital (510) if a digital filter is used. The sound profile can beadjusted according to user input (e.g., a control knob) on theheadphones (515). The headphones can apply a sound profile (520). Theheadphones can then create a mono signal (525) using known mixingtechniques. The mono signal can be low-pass filtered (530). The low-passfiltered mono signal can be amplified (535). In some implementations(e.g., when the audio is digital), the stereo audio signal can also beamplified (540). The amplified signals can then be transmitted to theirrespective drivers (545). For example, the low-pass filtered mono signalcan be sent to a haptic device and the amplified left and right channelcan be sent to the left and right drivers respectively.

FIG. 3 shows a system capable of performing these steps. The stepsdescribed in FIG. 5 need not be performed in the order recited and twoor more steps can be performed in parallel or combined. In someimplementations, other types of media also can be shared or manipulated,including audio or video.

FIG. 6 shows steps for obtaining and applying sound profiles. A mobiledevice, such as mobile device 110, can wait for media to be selected forplayback or loaded onto a mobile device (605). The media can be a song,album, game, or movie. Once the media is selected, metadata for themedia is parsed to determine if the media contains music, voice, or amovie, and what additional details are available such as the artist,genre or song name (610). The metadata is used to request a soundprofile from a server over a network, such as the Internet, or fromlocal storage (615). For example, Alpine could maintain a database ofsound profiles matched to various types of media and matched to aparticular model of headphones. The sound profile could containparameters for increasing or decreasing various frequency bands andother sound parameters for enhancing portions of the audio, such asparameters for modifying Alpine's MX algorithm. The sound profile isreceived (620) and then adjusted to a particular user's preference(625). The adjusted sound profile is then transmitted (630) to areproduction device, such as a pair of headphones. The adjusted profileand its associated metadata can also be transmitted (640) to the serverwhere the sound profile, its metadata and the association is stored forlater analysis.

FIG. 4 shows a system capable of performing these steps. The stepsdescribed in FIG. 6 could also be performed in headphones connected to anetwork without the need of an additional mobile device. The stepsdescribed in FIG. 6 need not be performed in the order recited and twoor more steps can be performed in parallel or combined. In someimplementations, other types of media also can be shared or manipulated,including audio or video.

FIG. 7 shows another headphone including multiple haptic devices. FIG. 7shows a headphone 700. Headphone 700 can have components similar toheadphone 200 and can function similarly. The details regardingheadphone 700 are incorporated herein. Headphone 700 can include hapticdevice 740. Headphone 700 can include a right haptic device 755 attachedto right ear cup 720. Headphone 700 can include a left haptic device 735attached to left ear cup 730. Signal processing components 760 caninclude additional components to separately process low pass signals forthe left and right channels, separately amplify those signals, andprovide them to the left and right haptic devices 735 and 755,respectively. Signal processing components 760 must take care to avoidphase issues that can occur in conjunction with the creation of the monosignal. The additional haptic devices can allow for increased basssensations isolated to an individual ear. The ability to separatelygenerate vibrations for each ear is particularly useful in gamingenvironments and with signals in the higher end of the low frequencyspectrum.

FIG. 8 shows a haptic-headphone-testing environment 800.Haptic-headphone-testing environment 800 can determine whether a hapticheadphone has been assembled correctly by measuring the amplitude at oneor more specific calibrated frequencies to determine whether allcomponents of the headphone have been assembled to the correcttolerance. Haptic-headphone-testing environment 800 can utilize afrequency sweep as an input signal and can observe the vibrationsexerted by the headphone throughout the sweep to determine whether theheadphone has any artifacts generated from loose or defective parts.Haptic-headphone-testing environment 800 can also be used to calibrate ahaptic headphone.

Haptic-headphone-testing environment 800 includes headphone 830.Headphone 830 can be the type describe above as headphone 120, headphone200, or headphone 700, and can have a haptic device that generateshaptic sensations. Headphone 830 can be placed on test structure 820 asshown.

Test structure 820 can include vibration sensors that monitor the hapticvibrations generated by headphone 830 at specific points on headphone830. The vibration sensors can include accelerometers or othertransducers capable of measuring vibrations. The vibration sensors canbe positioned at points where a headphone is designed to transmitvibrations to the user-haptic sensation transfer points. For example,the haptic sensation transfer points for headphone 120, headphone 200,or headphone 700 would be at the top of the headband at the left earcup, and/or the right ear cup. In another embodiment, the hapticsensation transfer points could be at just the right and left ear cups.Or, for earbuds, the haptic sensation transfer points could be at thetip of the ear bud. Test structure 820 call be used to measure andcalibrate a haptic response of headphone 830.

Haptic-headphone testing device 810 can communicate with headphone 830through cable 840 and with test structure 820 through cable 850. Inanother embodiment, haptic-headphone testing device 810 can wirelesslyconnect to headphone 830 and test structure 820. Haptic-headphonetesting device 810 can send audio signals to headphone 830. Whenheadphone 830 creates haptic sensations or vibrations, those vibrationscan be sensed by the vibration sensors on test structure 820 and thatinformation can be sent back to haptic-headphone testing device 810.Haptic-headphone testing device 810 can then analyze the signals fromthe vibration sensors to determine if the headphone has been properlymanufactured and assembled. Haptic-headphone testing device 810 can alsorecalibrate the settings in headphone 830, including gain to each driverand/or the haptic device, the crossover for the haptic device, theequalization settings for each driver, or other reproduction settingsand then retest the headphone with those settings.

In another embodiment, test structure 820 can include microphone 982 onthe plates near the ear cups of headphone 830. Haptic-headphone device810 can also analyze the acoustic signals received by the microphones todetermine if headphone 830 is correctly assembled. Haptic-headphonetesting device 810 can then recalibrate settings in headphone 830 toimprove the acoustic reproduction of headphone 830 and to better blendthe acoustic and haptic reproduction of headphone 830. Recalibratedsettings can include changing various reproduction settings, includingthe gain on the haptic device, left driver, right driver, equalizersettings, or the crossover frequency for the haptic device or thedrivers.

FIGS. 9A-9B show a haptic-headphone-testing structure. FIGS. 9A-9B showa headband assembly (e.g. 920, 925, 930, 935, 940, 942). Test structure900, as described below in more detail, includes multiple accelerometersplaced at haptic sensation transfer points and microphones placed neardriver locations. Test structure 900 can include base 910. Headbandcolumn base 920 can be attached to base 910. Headband column extension935 can include headband column extension tongue 930, which correspondsto a groove (not shown) on the backside of headband column base 920.Headband column extension tongue 930 and its corresponding groove canallow headband extension 935 to be adjusted vertically. Screw 925 can beloosened to allow headband column extension tongue 930 to slide in itscorresponding groove or can be tightened once the correct height isachieved. A corresponding screw 925 (not shown) for the backside oftesting structure 900 can also be used in a likewise manner. Headbandbridge 960 can connect the two headband column extensions 935 andprovide additional stability. Headband plate 945 can sit atop the twoheadband column extensions 935. Headband plate 945 can be looselysecured by rods 940. Rods 940 can be screws with a smooth shaft towardsthe head of the screw. Rods 940 can allow headband plate 945 to move upand down. Rods 940 can be flush against headband plate 945 or rise abovethe top of headband plate 945. Springs 942 can be inserted on rods 940and in between headband plate 945 and headband column extension 935.Springs 942 can be made of steel. Spring 942 can push up on headbandplate 945 and allow headband plate 945 to freely float and vibrate.Headband plate 945 can include headband plate saddle 955. Headband platesaddle 955 can be used to settle the headband of headphones placed ontesting structure 900 and can keep them in place while the headphonesare providing haptic feedback. Headband vibration sensor 950 can be usedto measure the vibrations provided through the headband of a headphone,which are intended to measure the vibrations that would ordinarily betransmitted to the top of a user's skull.

FIG. 9A shows one ear-cup assembly (e.g., 965, 970, 975, 977, 980, and985) which will be described below in more detail. FIG. 9B shows aside-view that demonstrates there is a corresponding ear-cup assembly onthe opposite side of test structure 900. The following descriptionfocuses on one ear-cup assembly (i.e., the left one) with theunderstanding that there is a nearly identical ear-cup assembly (i.e.,the right one) on the opposite side as show in FIG. 9B.

Ear cup column 965 can sit in groove 990 and can slide back and forth ingroove 990. There can be a screw attached to the bottom of ear cup 965(not shown) that can be tightened to secure the position of ear cupcolumn 965 in groove 990. Ear cup bridge 970 can connect two of the earcup columns 965 to create a more rigid and study ear cup assembly. Earcup bridge 970 can be secured to ear cup column 965 through screws inear up column countersinks 995. Ear cup plate 985 sits is adjacent toear cup columns 965. Ear cup plate 985 can be loosely secured to ear cupcolumns 965 by rods 975. Rods 975 can be screws with a smooth shafttowards the head of the screw. Rods 975 can allow ear cup plate 985 tomove sideways. Rods 940 can be flush against headband plate 945 or stickoutside the outermost side of ear cup plate 945. Springs 977 can beinserted on rods 940 and in between ear cup plate 985 and ear cupcolumns 965. Springs 977 can be made of steel. Spring 977 can push outear cup plate 985 and allow ear cup plate 985 to freely float andvibrate. Ear cup plate 985 can include ear cup plate flange 987. Ear cupplate flange 987 can be used to settle the ear cup of headphones placedon testing structure 900 and can keep the ear cup in place while theheadphones are providing haptic feedback. Ear cup vibration sensor 980can be used to measure the vibrations provided through the ear cup of aheadphone being tested, which is intended to measure the vibrations thatwould ordinarily be transmitted to the user's skull around the user'sear.

Test structure 900 can be adjusted to fit different sizes of headphones.Sliding ear cup column 965 of one of the ear-cup assemblies or for bothear-cup assemblies allows the user to position the ear cup assembliessuch that they sit tightly against the ear cups of the headphone beingassembled. This can ensure that there is a specific amount of pressurebetween each ear cup plate 985 and the ear cup of the headphone beingtested. For example, test structure 900 can be adjusted and/orcalibrated so that when a particular headphone is tested it is in astretched state exerting a specific clamping force of 700 g between theleft ear cup and right ear cup of the headphones. In another embodiment,test structure 900 can include pressure sensors in ear cup plates 985that measure and transmit the amount of clamping force. The pressuresensors can be connected to the haptic-headphone testing device 810 asdescribed below.

Similarly, headband column extension tongue 930 can slide in itscorresponding groove to achieve a specific height that provides theright amount of pressure between headband plate 945 and the headband ofthe headphone being tested. For example, test structure 900 can beadjusted and/or calibrated so that when a particular headphone is testedit is exerting a specific force approximately equal to the weight of theheadphone on headband plate 945. In another embodiment, test structure900 can include pressure sensors in headband plate 945 that measure andtransmit the amount of force. The pressure sensors can be connected tothe haptic-headphone testing device 810 as described below.

In another embodiment, test structure 900 can be made for a specificheadphone and be non-adjustable. For example, parts 910, 920, 930, 920,965, and 970 could be printed as a single piece using a 3D printer orcast from a single block of plastic or metal by a machine. In yetanother embodiment, test structure 900 can be made to be adjustable inonly the horizontal direction. In yet another embodiment, test structure900 can be made to be adjustable in only the vertical direction.

Base 910 can be made of metal, a heavy composite material, or a lightermaterial if secured to something larger and/or heavier. Headband plate945 and ear cup plate 985 can be made of lightweight plastic or otherlightweight materials and can be rigid. The columns, column extensions,and bridges (i.e., 920, 930, 935, 960, 965, 970) can be made of otherrigid plastic or materials and can be made of heavier materials than theplates.

The vibration sensors 950 and 980 can use accelerators, and can have upto 1.5 G of resolution that can enable sufficient resolution for hapticfeedback. The vibration sensors 950 and 980 can be connected to thehaptic-headphone testing device 810 as described below. The vibrationsensors 950 and 980 can be attached to the relatively lightweightheadband plate 945 and ear cup plate 985 which, as described above, areconnected to the test structure 900 in a way to allow the plates tovibrate and cause the sensors to generate a reading. The measured hapticvibrations of a headphone being tested can be then be used to determinewhether the headphone has been assembled correctly or whether it needscalibrating.

In another embodiment microphone sensor 982 can be inserted into the earcup flange 987 to measure acoustic reproduction of headphone beingtested. The microphone sensors can be connected to the haptic-headphonetesting device 810 as described below.

Test Structure 910 can be modified to accommodate different headphoneconfigurations. For example, the ear-cup assemblies can be modified toaccommodate different headphone types, including on-ear headphones orearbud headphones. Ear cup plate 985 can be countersunk or molded tohold the on-ear headphones or earbud headphones, rather than havingflange 987. Microphones can be placed where acoustic energy is intendedto be transmitted. As another example, test structure 900 can bemodified to account for additional haptic sensors in the headphone beingtested. Multiple headband plates can be posited to accommodateadditional haptic sensors in the headband. Also, additional vibrationsensors can be placed at additional haptic sensation transfer points.

FIGS. 10A-10G show graphical user interfaces for testing hapticheadphones. FIG. 10A shows an enlarged view of the graphical userinterface 1000 that can be used to control communications with teststructure 900, including sending test signals, receiving sensor signalsfrom the sensors in test structure 900, analyzing the signals, anddisplaying results. Interface 1000 includes menu bar 1002 that can beused to generally control the application, including selecting a suiteof test signals to use, closing interface 1000, saving results, oropening results from a prior test. Interface 1000 includes boardconnector bar 1005. Board connector bar 1005 can be used to controlcommunication with the sensor boards in test structure 900. Boardconnector bar 1005 can be used to establish connection with the sensorboards in test structure 9000, select which port to use to communicatewith them and the data (i.e., baud) rate. Board connector bar 1005 canbe used to control a serial port, USB port, networking connection, orother computer ports for use in interfacing with the sensors of teststructure 900.

Interface 1000 includes a graph area 1010. Graph area 1010 can displaythe status of signals in real time. It can display the audio and/orhaptic signals being sent to a headphone being tested or the signalsbeing received from the sensors in test structure 900. Graph area 1010includes a vertical axis 1012 that displays the magnitude of the signal.Graph area 1010 can dynamically change the scale of the vertical axis1012 to increase or decrease the size of the signals being displayed.Graph area 1010 can also adapt the units on the vertical axis 1012 tomatch the type of signal being displayed. A user also can change thevertical axis 1012 by clicking on button 1072. Graph area 1010 includeshorizontal axis 1015. Horizontal axis 1015 displays units of time. Grapharea 1010 can dynamically change the scale of the horizontal axis 1015to increase or decrease the size of the signals being displayed. A useralso can change the horizontal axis 1015 by clicking on button 1074.Clicking on button 1076 can bring up a zoom tool that allows the user tozoom in on a particular area. Clicking on button 1078 adds or removesthe graph lines behing graph area 1010.

Setting interface 1018 can be part of interface 1000. Setting interface1018 can include a legend that identifies each signal displayed in grapharea 1010 by name. For example, a first signal is identified as EarL1020, which can be understood to be a signal representing the Left Ear.Likewise, EarR 1025 can be understood to be a signal representing theRight Ear and Top 1030 can be understood to be a signal representing theTop of the Head. Setting interface 1018 shows these signals withdifferent dashed formats. Setting interface 1018 can show these signalswith different colors as well. Setting interface 1018 an also be used toselect which of the signals to display at a given time. Settinginterface 1018 can also include sample interval 100 that can control howmany samples per second are captured from the sensors in test structure900. The sampling rate can be set to the maximum sampling rate allowedby the hardware. Setting interface 1018 can include test times 1040 thatcan be set to control how long a given test is run. Setting interface1045 can include calibration button 1045, which can be used to measurethe baseline response of haptic-headphone testing device 810 when it isempty. Calibration button 1045 can also expose a prompt to allow theuser to set the start and stop frequencies for test signals, set theduration of the test, set the amplitude of the test signal, set theminimum or maximum threshold values for haptic or audio feedback.Calibration button 1045 can also expose a prompt that can include valuesfor the haptic frequency response and/or audio frequency response of theentire headphone system. Calibration button 1045 can also be used tosend a suite of specific signals to a headphone being tested, measurethe signals received from the sensors, and then automatically adjust thereproduction settings of the headphone.

Start/stop button 1050 can be used to initiate a test. Once start button1050 is pressed, it can display the word “Stop,” and if pressed again,stop the test. Result 1055 can display the analyzed results of a giventest and inform an operator whether a headphone passed the test. Result1055 can display whether the whole headphone passed or can display moredetailed results pinpointing failure of an explicit part of theheadphone (e.g., Left, Right, Top).

Graph area 1010 can display multiple signals simultaneously or select todisplay one signal at a time. Graph area 1010 can display signal 1070which represents the signal from a sensor on a headband plate, adjacentto the headband of the headphone being tested, and has a dashed linematching the format of Top 1030. Graph area 1010 can display signals1060 which represents the signal from a sensor on the left ear cupplate, adjacent to the left ear cup of the headphone being tested, andhas a dashed line matching the format of EarL 1020. Graph area 1010 candisplay signals 1065 which represents the signal from a sensor on theright ear cup plate, adjacent to the right ear cup of the headphonebeing tested, and has a dashed line matching the format of EarR 1025.Graph area 1010 can also display failing signals such as signals 1080,1085, and 1090, which showing exemplary failing signals for sensors inthe left ear cup plate, right ear cup plate, or headband plate,respectively.

Graph area 1010 can display the 3 points of measurements as depicted inFIG. 10A or show them separately as depicted in FIGS. 10B, 10C, and 10D.FIGS. 10B, 10C, and 10D show specific signals for haptic feedback andwhat a particular passing signal looks like given a specific input.FIGS. 10E, 10F, and 10G shows specific signals for haptic feedback andwhat a particular failing signal looks like given a specific input.

Interface 1000 can be used to simultaneously test multiple headphones.Model test signals and sensor response signals for each headphone can bestored. A suite of model test signals for a given headphone can be sentto the headphone and the results compared to the model results. Forexample, test signals can include sine sweeps, broad spectrum whitenoise, and short duration impulses and model responses for each of thosesignals can be stored and compared. Interface 1000 can also be used toreceive and show the results of pressure sensors on test structure 900,to ensure the headphones are properly seated and test structure 900 isproperly configured. Interface 1000 can also be used to receive anddisplay signals from microphones on test structure 900 to measure theacoustic performance of a headphone and/or the combined acoustic andhaptic performance of a headphone.

Interface 1000 can run on haptic-headphone testing device 810, includingusing haptic-headphone testing device 810's display to display theinterface 1000 and using haptic-headphone testing device 810's inputs tointeract with and control test structure 900. The testing process isdescribed in more detail below with respect to FIG. 12.

FIG. 11 shows a block diagram of a haptic-headphone testing device. FIG.11 presents a computer system 1100 that can be used to implement thetechniques described herein for testing haptic headphones, running anddisplaying interface 1000, and communicating with testing structure 900.Computer system 1100 can be implemented inside of haptic-headphonetesting device 810. Bus 1165 can include one or more physicalconnections and can permit unidirectional or omnidirectionalcommunication between two or more of the components in the computersystem 1100. Alternatively, components connected to bus 1165 can beconnected to computer system 1100 through wireless technologies such asBluetooth, Wifi, or cellular technology. The computer system 1100 caninclude a microphone 1145 for receiving sound and converting it to adigital audio signal. The microphone 1145 can be coupled to bus 1165,which can transfer the audio signal to one or more other components.Computer system 1100 can include a headphone jack 1160 for transmittingaudio and data information to headphones and other audio devices.

An input 1140 including one or more input devices also can be configuredto receive instructions and information. For example, in someimplementations input 1140 can include a number of buttons. In someother implementations input 1140 can include one or more of a mouse, akeyboard, a touch pad, a touch screen, a joystick, a cable interface,and any other such input devices known in the art. Further, audio andimage signals also can be received by the computer system 1100 throughthe input 1140.

Further, computer system 1100 can include network interface 1120.Network interface 1120 can be wired or wireless. A wireless networkinterface 1120 can include one or more radios for making one or moresimultaneous communication connections (e.g., wireless, Bluetooth, lowpower Bluetooth, cellular systems, PCS systems, or satellitecommunications). A wired network interface 1120 can be implemented usingan Ethernet adapter or other wired infrastructure.

An audio signal, sensor signals, image signal, user input, metadata,other input or any portion or combination thereof, can be processed inthe computer system 1100 using the processor 1110. Processor 1110 can beused to perform analysis, processing, editing, playback functions, or tocombine various signals, including parsing or analyzing the sensorsignals and comparing them to model signals.

For example, processor 1110 can compare the similarities of sensedsignals to model signals stored in memory 415 and determine if thesignals are similar. As another example, processor 1110 can runinterface 1000 as described above or run the testing process asdescribed below for testing haptic headphones. Processor 1110 cangenerate test signals, such as a test signal at a specific tone orfrequency, a signal sweep, or various types of noise. For example,processor 1110 can generate sine sweeps, broad spectrum white noise, andshort duration impulses used to test. Processor 1110 can also processsensor signals, analyze the signals, and determine whether a headphonebeing tested passes the requirements.

Processor 1110 can then use input received from input 1140 to controlinterface 1000. Processor 1110 can also run applications on computersystem 1100 like Alpine's Tune-It mobile application, which can adjustsound profiles. The sound profiles can be used to adjust Alpine's MXalgorithm.

Processor 1110 can use memory 1115 to aid in the processing of varioussignals, e.g., by storing intermediate results. Memory 1115 can bevolatile or non-volatile memory. Either or both of original andprocessed signals can be stored in memory 1115 for processing or storedin storage 430 for persistent storage. Further, storage 1130 can beintegrated or removable storage such as Secure Digital, Secure DigitalHigh Capacity, Memory Stick, USB memory, compact flash, xD Picture Card,or a hard drive.

Processor 1110, like processors 350 and 410, can be hardware processorsor computer chips. For example, they can be an x86 CPUs, GPUs, or mobileprocessors such as an ARM or DSP chip.

Image signals accessible in computer system 1100 can be presented on adisplay device 1135, which can be an LCD display, printer, projector,plasma display, or other display device. Display 1135 also can displayone or more user interfaces such as an input interface. The audiosignals available in computer system 1100 also can be presented throughoutput 1150. Output device 1150 can be a speaker. Headphone jack 1160can also be used to communicate digital or analog information, includingaudio, test signals, and reproduction settings.

Sensors 1170 can be connected to system 1100 through connection 1180.Sensors 1170 can include pressure sensors, including pressure sensors ontest structure 900. Sensors 1170 can include vibration sensors,including vibration sensors or other transducers on test structure 900.Sensors 1170 can also connect to system 1100 through network interface1120, input 1140 or headphone jack 1160. External microphone 1175 canalso be connected to system 1100 through connection 1180. Externalmicrophone 1175 can also connect to system 1100 through networkinterface 1120, input 1140 or headphone jack 1160.

Bus 1165, network interface 1120, or headphone jack 1160 can be used totransmit audio and/or data to haptic headphone 830, headphone 120,headphone 200, or headphone 700. The audio and data information sent toa headphone can be used to test the headphones. Bus 1165, networkinterface 1120, or headphone jack 1160 can also be used to calibrate theheadphones. Calibration can include adjusting reproduction parametersfor a headphone.

In an alternative embodiment, haptic-headphone testing device 810 can bea mobile device. In an alternative embodiment, computer system 1100 cansimultaneously control multiple test structure 900 s.

FIG. 12 shows steps for testing haptic headphones. A computer device,such as haptic-headphone testing device 810, can wait for a user toinitiate the test (1205) or can initiate the test automatically (1205)once pressure sensors on test rig 900 indicate a headphone are properlyseated on test rig 900. Once the test is started, test signals can beobtained (1208) including generating the test signals or retrieving themfrom memory. The test signals can include separate signals for aheadphone's left driver, right driver, and/or haptic device. Once thetest signals are obtained, the test signals can be transmitted to theheadphone (1210). While the test signals are being transmitted to theheadphone (1210), the left ear cup sensors can be captured (1215), theright ear cup sensors can be captured (1220), and the top sensors can becaptured (1225). The sensor signals can be displayed while they arebeing captured. The displaying of the sensors signals can be inreal-time. Capturing (1215) can include capturing signals from thevibration sensor and/or the microphone on test structure 900 on an earcup plate for the left ear cup of the headphone being tested. Thecapturing (1215) can include recording and/or storing the signals.Capturing (1220) can include capturing signals from the vibrationsensors and/or the microphone on test structure 900 on an ear cup platefor the right ear cup of the headphone being tested. The capturing(1220) can include recording and/or storing the signals. Capturing(1225) can include capturing signals from the vibration sensor on teststructure 900 on a headband plate for the headband of the headphonebeing tested. The capturing (1220) can include recording and/or storingthe signals. Once one or more of the signals are captured, the capturedsignals can be aligned (1230). Aligning the captured signals can accountfor any delay between when the transmitted test signal (1210) is sent,and when the signals received from the sensors are received andcaptured. Signals need not be aligned to be analyzed.

Once one or more signals can be captured and possibly aligned, thesignals can be analyzed (1240). The analysis can be done using atime-comparison function, cross-correlation techniques, stochasticanalysis, comparing the frequency spectrum of the two signals, as wellas general signal measurements like normalized RMS, coherence, temporalpredictability, Gaussian probability density function, or statisticalindependence. If all signals meet predetermined thresholds of similarityto model signals or predetermined coefficients, the headphones beingtested are identified as passing headphones. If the signals do not meetpredetermined thresholds of similarity to model signals or predeterminedcoefficients, the headphones being tested are identified as failingheadphones. Once the analysis is complete, the signals and/or thepassing or failing result can be displayed (1250). If a headphone isdetermined to fail, it can be selected for additional testing (1270). Ifthe headphone passed and no additional testing is required (1260), theprocessor starts over waiting for the test to start (1205).

If additional testing is determined to be required (1260), the headphonecan be calibrated (1270). Calibration test signals can be sent to theheadphone, the sensors can gauge the headphone's response, andcalibration parameters can be sent to the headphone to modify theheadphones production parameters (1270). For example, if one driver ismore efficient and thus louder than the other driver, the gain for oneor both drivers can be adjusted to compensate. As another example, ifthe haptic feedback is too intense for a given input or too muted, thegain for the haptic feedback can be adjusted. Other reproductionparameters can also be adjusted. The test signals can be changed (1280)to isolate a point of failure or to more deeply examine a headphone. Forexample, if the headphones failed because of the signal received fromsensors adjacent to a left ear phone of the headphones being tested, asuite of signals could be sent to just the left ear phone to determineits specific failure point. As another example, if the haptic sensationis dampened it can suggest a defect in assembly where the transducer isnot fully fastened to the headband structure. As another example, if thehaptic sensation is dampened or the acoustic transmission is lessened oras a different frequency response, it can suggest the use ofnon-compliant parts. Modifications to the headphone as a result oftesting can include replacing faulty components (e.g. drivers,transducer, headband, connectors), reworking the headphones to tightenfasteners, and re-programming one or more customized tuning parametersor reproduction parameters in the software in the processor for thespecific headphone to compensate for hardware variations.

FIG. 11 shows a system capable of performing these steps. The stepsdescribed in FIG. 12 need not be performed in the order recited and twoor more steps can be performed in parallel or combined. In someimplementations, other types of signals can be received and measured.

A number of examples of implementations have been disclosed herein.Other implementations are possible based on what is disclosed andillustrated.

What is claimed is:
 1. A method for manufacturing a haptic headphonecomprising a headband with a right ear cup attached to one end of theheadband with a right driver configured to receive a right audio signaland reproduce sound, a left ear cup attached to the other end of theheadband with a left driver configured to receive a left audio signaland reproduce sound, and a haptic device attached to the headband andconfigured to receive a combination of the right and left audio channelsand to produce tactile vibrations, the method comprising: initiating, ona computer system, a test of a haptic-headphone; obtaining, on thecomputer system, a left audio test signal and a right audio test signal;transmitting, on the computer system, the left audio test signal and theright audio test signal to a test structure; capturing, on the computersystem, one or more vibration signals from one or more vibration sensorson the test structure that represent the tactile vibration of the hapticsensation transfer points of the haptic headphone; retrieving, from thememory of the computer system, one or more model vibration signals;determining, on the computer system, the similarity of the one or morevibration signals to the one or more model vibration signals;displaying, on a display of the computer system, the result of thedetermination; and calibrating the headphones based on thedetermination.
 2. The method of claim 1, wherein there are at least twohaptic sensation transfer points.
 3. The method of claim 1, wherein thedetermining comprises a cross-correlation analysis of the left vibrationsignal and the model left vibration signal, the right vibration signaland the right model vibration signal, or the top vibration signal andthe model top vibration signal.
 4. The method of claim 1, wherein thecalibration comprises modifying the gain to one of the haptic device,the left driver, or the right driver of the haptic headphone.
 5. Themethod of claim 1, wherein the one or more vibration signals are alignedafter they are captured.
 6. The method of claim 1, wherein the computersystem automatically initiates the test when a pressure sensor on thetest structure indicates a headphone is properly seated on at least aportion of the test structure.
 7. The method of claim 1, furthercomprising: displaying, on a display of the computer system, the one ormore vibration signals.
 8. The method of claim 1, wherein thecalibrating comprises modifying the gain to one of the haptic device,the left driver, or the right driver of the haptic headphone.
 9. Themethod of claim 1, wherein the calibrating comprises modifying areproduction setting.
 10. The method of claim 1, wherein the calibratingcomprises modifying a crossover frequency.
 11. The method of claim 1,wherein the calibrating comprises reprogramming the processor in thehaptic headphone.
 12. The method of claim 1, wherein the calibratingcomprises reworking the haptic headphone.
 13. An apparatus for testing ahaptic headphone comprising a headband with a right ear cup attached toone end of the headband with a right driver configured to receive aright audio signal and reproduce sound, a left ear cup attached to theother end of the headband with a left driver configured to receive aleft audio signal and reproduce sound, and a haptic device attached tothe headband and configured to receive a combination of the right andleft audio channels and to produce vibrations, the apparatus comprising:a base; a front-headband column attached to the base; a back-headbandcolumn attached to the base; a headband bridge attached to thefront-headband column on the headband bridge's one end and theback-headband column on the headband bridge's other end; a headbandplate loosely attached to the top of the front-headband column on theheadband plate's one end and the back-headband column on the headbandplate's other end; wherein the headband plate's loose attachmentcomprises rods and springs; a left-front-ear-cup column attached to thebase; a left-back-ear-cup column attached to the base; a left-ear-cupbridge attached to the left-front-ear-cup column on the left-ear-cupbridge's one end and the left-back-ear-cup column on the left-ear-cupbridge's other end; a left-ear-cup plate loosely attached to the side ofthe left-front-ear-cup column on the left-ear-cup plate's one end andthe side of the left-back-ear-cup column on the left-ear-cup plate'sother end; wherein the left ear-cup plate's loose attachment comprisesrods and springs; a left vibration sensor attached to the left-ear-cupplate; a right-front-ear-cup column attached to the base; aright-back-ear-cup column attached to the base; a right-ear-cup bridgeattached to the right-front-ear-cup column on the right-ear-cup bridge'sone end and the right-back-ear-cup column on the right-ear-cup bridge'sother end; a right-ear-cup plate loosely attached to the side of theright-front-ear-cup column on the right-ear-cup plate's one end and theside of the right-back-ear-cup column on the right-ear-cup plate's otherend; wherein the left ear-cup plate's loose attachment comprises rodsand springs; a right vibration sensor attached to the right-ear-cupplate.
 14. The apparatus of claim 13, further comprising: a headbandvibration sensor attached to the headband plate.
 15. The apparatus ofclaim 13, wherein the attachment of the front-headband column,back-headband column, left-front-ear-cup column, left-back-ear-cupcolumn, right-front-ear-cup column, and right-back-ear-cup column to thebase are adjustable relative to the base.
 16. The apparatus of claim 13,wherein the front-headband column and back-headband column each comprisea headband column base and headband column extension that can adjust theheight of each of the headband columns.
 17. The apparatus of claim 13,wherein the front headband column, back headband column, and headbandbridge; the left-front-ear-cup column, left-back-ear-cup column, andleft-ear-cup bridge; or the right-front-ear-cup column,right-back-ear-cup column, and right-ear-cup bridge are formed from asingular piece of material.
 18. The apparatus of claim 13, wherein thefront headband column, back headband column, headband bridge,left-front-ear-cup column, left-back-ear-cup column, left-ear-cupbridge, right-front-ear-cup column, right-back-ear-cup column, andright-ear-cup bridge are formed from one or more pieces of material. 19.The apparatus of claim 13, further comprising: a pressure sensorattached to the headband plate.
 20. The apparatus of claim 13, furthercomprising: a computer operatively connected to the right vibrationsensor and left vibration sensor, and configure to receive tactilevibration signals form the right vibration sensor and left vibrationsensor.